Last edited by Voshakar
Friday, May 1, 2020 | History

4 edition of Electrical performance of electronic packaging found in the catalog.

Electrical performance of electronic packaging

October 28-30, 1996, The Inn of Napa Valley, Napa, California

  • 332 Want to read
  • 8 Currently reading

Published by IEEE Service Center in Piscataway, NJ .
Written in English

    Subjects:
  • Electronic packaging -- Congresses.,
  • Materials -- Electric properties -- Congresses.

  • Edition Notes

    Other titlesIEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging
    Statementsponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society.
    ContributionsIEEE Microwave Theory and Techniques Society., Components, Packaging & Manufacturing Technology Society., Topical Meeting on Electrical Performance of Electronic Packaging (5th : 1996 : Napa, California)
    Classifications
    LC ClassificationsTK7870.15 .E382 1996
    The Physical Object
    Paginationix, 242 p. :
    Number of Pages242
    ID Numbers
    Open LibraryOL725236M
    ISBN 100780335147, 0780335155
    LC Control Number97113321
    OCLC/WorldCa36233074

    About the Journal. The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.   Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly. Book Description. The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play.

      Many of the formal technical publications of the NASA Glenn Smart Sensors and Electronics Systems Branch are listed in the below table. These technical publications are posted on this site in order to ensure timely public dissemination of NASA technical work.   Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and : $


Share this book
You might also like
The travels of Cyrus

The travels of Cyrus

On the contributions of Hugh Owen Thomas of Liverpool, Sir Robert Jones of Liverpool and London, and John Ridlon, M.D. of New York and Chicago to modern orthopedic surgery

On the contributions of Hugh Owen Thomas of Liverpool, Sir Robert Jones of Liverpool and London, and John Ridlon, M.D. of New York and Chicago to modern orthopedic surgery

Teddybears Eat Out (Teddy Bears Books)

Teddybears Eat Out (Teddy Bears Books)

Credit, sales & other consumer transactions.

Credit, sales & other consumer transactions.

NMS

NMS

The heavenly cloud now breaking

The heavenly cloud now breaking

Corporate philanthropic public service activities

Corporate philanthropic public service activities

Recent advances in numerical weather prediction

Recent advances in numerical weather prediction

Social mobility and class structure.

Social mobility and class structure.

Bottomtime.

Bottomtime.

Mar Abimalek Timotheus

Mar Abimalek Timotheus

Introductory Horiculture Laboratory Manual

Introductory Horiculture Laboratory Manual

Graphing Grade 5

Graphing Grade 5

The triumphs of health and prosperity

The triumphs of health and prosperity

Archaelogical data as a basis for repository marker design

Archaelogical data as a basis for repository marker design

Submerged lands

Submerged lands

Electrical performance of electronic packaging Download PDF EPUB FB2

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also Electronic Packaging Handbook, a new volume 5/5(2).

EPEPS Conference OctoberEPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Get this from a library. Electrical performance of electronic packaging: October, the Hotel Thayer, West Point, New York. [IEEE Microwave Theory and Techniques Society.; Components, Packaging & Manufacturing Technology Society.;].

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and by: Get this from a library.

Electrical performance of electronic packaging: October, Radisson Resort & Spa Scottsdale, Scottsdale, Arizona. [IEEE Microwave Theory and Techniques Society.; Components, Packaging & Manufacturing Technology Society.;].

The main objectives of electronic packaging are (a) the protection of the IC chip (or die) and (b) the interconnection of IC chips to other electronic components (i.e., IC chips, printed circuit boards (PCBs), transformers, and connectors) for transfer of electrical signals.

An electronic package may be designed to •. This book is a highly recommended reference for all mechanical (and, I suppose, some electrical) engineers working on packaging. The book covers many topics with enough detail so that the engineer may have a good holistic understanding of everything from: pcb design, layout and fabrication - component fundamentals including IC's - EMC issues - interconnect issues - reliability - testing/5(2).

Call for Papers. For a PDF version of the call for papers, please click here. EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems.

Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Check out Conference on Electrical Performance of Electronic Packaging and Systems DoubleTree by Hilton Hotel San Jose Dates Location Schedule Registration Agenda Reviews Exhibitor list. A 4 days conference, Conference on Electrical Performance of Electronic Packaging and Systems is going to be held in San Jose, USA from 04 Oct to 07 Oct focusing on Electronics & Electrical.

ECE Design of Electronic Packaging and Interconnects. packaging technology selection, electrical performance of packaging, thermal design, electrical design of printed circuit boards, backplane and multichip module interconnect, receiver and driver selection, EMI control, CAD tools, and measurement issues.

All exams are closed-book. IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) San Jose, CA USA Oct 4, - Oct 7, 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan - Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which provides protection for the die from the outside environment to that of an electrical interconnect that affects.

Abstract. Chapter 1 introduces the background of this book. It covers the historical evolution and basic performance metrics of IC packaging. The challenges from electrical, thermal and mechanical viewpoints are highlighted and possible solutions with design and.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.

It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. 2 POLYMERS FOR ELECTRONICS PACKAGING AND INTERCONNECTION important to address the role of polymers in electronic packaging and interconnection.

The symposium and this book have enabled us to assemble the results of research by experts in polyimides and related materials, polymeric encapsulants, gels, and printed wiring board (PWB). Electronic Packaging Materials and their Properties Article (PDF Available) in IEEE Electrical Insulation Magazine 17(5) - 60 October with 1, Reads How we measure 'reads'.

Check out Conference on Electrical Performance of Electronic Packages and Systems DoubleTree by Hilton Hotel San Jose Dates Location Schedule Registration Agenda Reviews Exhibitor list. A 4 days conference, Conference on Electrical Performance of Electronic Packages and Systems is going to be held in San Jose, USA from 04 Oct to 07 Oct focusing on Packaging product categories.

In this paper, preliminary work on electrical performance estimation and evaluation for multi-chip assemblies (i.e., multi-chip modules, chip on board, and etc.) is presented. A knowledge base is built to facilitate system performance merits evaluation process.

These packaging schemes are crucial to the overall reliability and performance of electronic ts of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectorsAddresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists 5/5(1).

Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe ing of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic t safety standards may dictate particular features of.Electronic materials and processes handbook, 3rd edition [Book Review] Article (PDF Available) in IEEE Electrical Insulation Magazine 20(5) 46 October with 2, Reads.Develop advanced packaging technologies for wide bandgap (WBG) power electronics: Advancing automotive power modules and power converters in electrical performance, cooling capability, thermomechanical performance, and manufacturability, resulting in - comprehensive improvement in cost-effectiveness, efficiency, reliability and power density of.